Maya Ellison
Plastic dual inline package (PDIP) is a type of integrated circuit (IC) packaging that features two parallel rows of metal pins, called dual in-line pins, on either side of a rectangular-shaped circuit. The plastic dual inline package is the most common and affordable option for IC packaging. It consists of two parallel rows of pins, providing insulation and protection for the ICs. The plastic housing is usually sealed by fusing or cementing the plastic halves around the leads, although this does not provide a high degree of hermeticity as the plastic is porous to moisture.
| Characteristics | Values |
|---|---|
| Full form | DIP (dual inline package) |
| Other names | DIL (dual in-line), DIPP (dual in-line pin package) |
| Shape | Rectangular |
| Rows of pins | Two parallel rows |
| Number of pins | Minimum 3 or 4, maximum 64 |
| Common number of pins | 14 or 16 |
| Distance between pins (pitch) | 0.1 inches (2.54 mm) |
| Distance between rows of pins (row spacing) | 0.3 inches (7.62 mm) or 0.6 inches (15.24 mm) |
| Materials | Plastic, epoxy, ceramic |
| Variants | Plastic DIP (PDIP), Ceramic DIP (CDIP), Shrink Plastic DIP (SPDIP), Skinny DIP (SDIP) |
| Uses | IC packaging, DIP switches, LEDs, seven-segment displays, bar graph displays, relays |
| Advantages | Cost-effective, compact size, easy assembly, good ruggedness, widely standardized, universal socket mounting, high-volume production, flexibility, thermal performance |
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What You'll Learn
- Plastic DIP (PDIP) packages are usually sealed by fusing or cementing the plastic halves
- Plastic DIPs are the most common and affordable option
- Plastic DIP packages are made from opaque moulded epoxy plastic
- Plastic DIPs are durable and protect internal components from damage
- Plastic DIPs are ideal for automated PCB assembly and wave soldering
Plastic DIP (PDIP) packages are usually sealed by fusing or cementing the plastic halves
Plastic Dual In-line Package (PDIP) is a type of integrated circuit (IC) packaging that features two parallel rows of metal pins, called dual in-line pins, on either side of a rectangular-shaped circuit. PDIP packages are usually sealed by fusing or cementing the plastic halves around the leads.
The process of sealing PDIP packages involves joining two plastic housing parts together around the electronic components. This can be done through various methods, including snapping, welding, or gluing the plastic halves. The leads, which are the metal pins, emerge from the longer sides of the package along the seam, bent downward by approximately 90 degrees.
While PDIP offers insulation and protection for the ICs, it does not provide a completely hermetic seal. This is due to the porous nature of the plastic, which allows some moisture to pass through. As a result, the microscopic spaces between the leads and the plastic along the perimeter may not be fully sealed. However, with reasonable care in a controlled environment, PDIP packages can effectively keep out contaminants and maintain reliable operation for decades.
PDIP is one of the most mature plastic IC packages still in use today. Its use has declined with the emergence of new surface-mount technology (SMT) packages, such as plastic leaded chip carriers (PLCC) and small-outline integrated circuits (SOIC). However, PDIP continues to be utilized and is commonly distinguished by its packaging material. Variants of PDIP include the Shrink Plastic Dual In-line Package (SPDIP) and the Skinny Dual In-line Package (SDIP).
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Plastic DIPs are the most common and affordable option
Plastic Dual Inline Packages (PDIPs) are the most common and affordable option in the DIP family. They are usually sealed by fusing or cementing the plastic halves around the leads. PDIPs are composed of two parallel rows of pins, providing insulation and protection for the ICs. They are made from an opaque moulded epoxy plastic pressed around a tin-, silver-, or gold-plated lead frame that supports the device die and provides connection pins. The plastic body transfers heat adequately and protects the internal components from damage.
PDIPs are cost-effective, inexpensive to manufacture and purchase compared to more advanced packages. They are compact in size, maximising PCB space usage with their dense, rectangular shape. They are easy to assemble, straightforward to manually insert and solder onto PCBs. PDIPs are widely standardised, with established standard pin spacing and dimensions for compatibility. They offer universal socket mounting, allowing interchangeability and no soldering. They are ideal for high-volume production and are suitable for automated PCB assembly and wave soldering.
PDIPs are flexible, available with pin counts from under 10 up to 64 to suit many chips. They have good thermal performance, with a moulded plastic body that transfers heat adequately. The plastic housing also provides protection from mechanical stress, such as bending or twisting, and temperature fluctuations, which can cause the pins to expand or contract and potentially lead to solder joint failure.
PDIPs have a standard distance between two pins (pitch) of 0.1 inches (2.54 mm). The most common row spacings are 0.3 inches (7.62 mm) or 0.6 inches (15.24 mm). The number of pins can range from as few as 3 or 4 up to several dozen, although 14- and 16-pin packages are most common.
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Plastic DIP packages are made from opaque moulded epoxy plastic
Plastic Dual Inline Packages (PDIPs) are electronic device packages with a rectangular housing and two parallel rows of electrical connecting pins. They are commonly used for integrated circuits (ICs), DIP switches, LEDs, seven-segment displays, bar graph displays, and relays.
The body of a DIP package is typically made through a thermoset moulding process, where an epoxy mould compound is heated and transferred under pressure to encapsulate the device. Cure cycles for the resins are usually less than two minutes, and a single cycle can produce hundreds of devices.
DIP packages are usually made from opaque moulded epoxy plastic pressed around a tin-, silver-, or gold-plated lead frame that supports the device die and provides connection pins. The lead frame protects the unit die and includes attachment pins. Some integrated circuits (ICs) use ceramic DIP packages for high-temperature or high-reliability applications or when an optical window to the interior of the package is required.
Plastic DIP packages are usually sealed by fusing or cementing the plastic halves around the leads. However, a high degree of hermeticity is not achieved due to the porosity of the plastic to moisture, and the process cannot ensure a microscopic seal between the leads and the plastic. Despite this, contaminants are typically kept out well enough for the device to operate reliably for decades in a controlled environment.
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Plastic DIPs are durable and protect internal components from damage
Plastic Dual Inline Packages (PDIPs) are a type of electronic component housing that contains an integrated circuit (IC) or other devices. They are commonly used in consumer electronics due to their affordability and ability to provide sufficient protection for most applications.
PDIPs are constructed from durable, high-quality plastic, offering robust protection against dust, moisture, and impact. This durability safeguards internal components from environmental damage, enhancing reliability and prolonging their lifespan. The plastic material also provides good insulation, preventing electrical shorts and protecting the IC from external influences.
The protective qualities of PDIPs are further enhanced by the plastic's heat-resistant properties, enabling effective operation in warm environments without succumbing to heat-related stress. This heat resistance is particularly advantageous in demanding conditions, ensuring the components maintain their performance standards.
While PDIPs are generally durable, they are not immune to all potential sources of damage. For instance, the pins of PDIPs are susceptible to bending or twisting, which can lead to solder joint failure. Therefore, careful handling and proper ESD-safe packaging during storage and transportation are crucial to prevent electrostatic discharge damage and ensure the long-term reliability of PDIPs.
Overall, Plastic Dual Inline Packages offer a robust and cost-effective solution for protecting internal components from various environmental factors and mechanical stresses. With their protective qualities, PDIPs have become a popular choice in the consumer electronics industry.
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Plastic DIPs are ideal for automated PCB assembly and wave soldering
Plastic Dual Inline Packages (PDIPs) are a type of integrated circuit (IC) packaging that features two parallel rows of metal pins. They are commonly used for ICs, switches, LEDs, and displays. PDIPs are usually sealed by fusing or cementing the plastic halves around the leads, providing insulation and protection for the ICs.
PDIPs are ideal for automated PCB assembly due to their standardised dimensions and compatibility. They have established standard pin spacing and dimensions, allowing for high-volume production. The sockets in PDIPs enable interchangeability and the absence of soldering. The notch in PDIPs also allows for visible orientation, making it easy to identify the proper alignment for assembly.
PDIPs are also suitable for wave soldering, a process where electronic components are attached to printed circuit boards (PCBs). Wave soldering is a faster and more reliable method compared to other soldering techniques. It involves submerging the components into a molten solder bath, coating all component surfaces with filler metal. This soldering method is suitable for prototyping and small-scale production, making PDIPs a versatile option for PCB assembly.
The use of PDIPs offers several advantages, including good ruggedness and thermal performance. The plastic or ceramic housing provides durability and protects the internal components from damage. Additionally, the molded plastic or ceramic body effectively transfers heat. PDIPs also offer flexibility in pin counts, ranging from under 10 to 64, making them compatible with a wide range of chips.
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